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Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis.
Ming-Chih Yew
Chan-Yen Chou
Kuo-Ning Chiang
Published in:
Microelectron. Reliab. (2007)
Keyphrases
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finite element analysis
stress distribution
reliability assessment
mechanical properties
finite element
finite element model
shear stress
computer aided design
using artificial neural networks
bp neural network model
material properties
friction coefficient
databases
neural network
case study
data model