Hsien-Chie Cheng

Publication Activity (10 Years)

Years Active: 2006-2016
Publications (10 Years): 1

Top Topics

Printed Circuit Boards

Data Generation

Molecular Dynamics

Top Venues

Microelectron. Reliab.

Publications

Hsien-Chie Cheng, Tzu-Chin Huang, Po-Wen Hwang, Wen-Hwa Chen
Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing. Microelectron. Reliab. 59 (2016)
Wen-Hwa Chen, Ching-Feng Yu, Hsien-Chie Cheng, Yu-min Tsai, Su-Tsai Lu
IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging. Microelectron. Reliab. 53 (1) (2013)
Wen-Hwa Chen, Ching-Feng Yu, Hsien-Chie Cheng, Su-Tsai Lu
Sn through molecular dynamics simulation and nanoindentation testing. Microelectron. Reliab. 52 (8) (2012)
Hsien-Chie Cheng, Kun-Yu Hsieh, Kuo-Ming Chen
Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology. Microelectron. Reliab. 51 (4) (2011)
Wen-Hwa Chen, Chun-Hung Wu, Hsien-Chie Cheng
Modified Nosé-Hoover thermostat for solid state for constant temperature molecular dynamics simulation. J. Comput. Phys. 230 (16) (2011)
Li-Cheng Shen, Chien-Wei Chien, Hsien-Chie Cheng, Chia-Te Lin
Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection. Microelectron. Reliab. 50 (4) (2010)
Hsien-Chie Cheng, Chiu-Shia Fen
A web-based distributed problem-solving environment for engineering applications. Adv. Eng. Softw. 37 (2) (2006)