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IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging.
Wen-Hwa Chen
Ching-Feng Yu
Hsien-Chie Cheng
Yu-min Tsai
Su-Tsai Lu
Published in:
Microelectron. Reliab. (2013)
Keyphrases
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high density
high speed
high temperature
printed circuit boards
failure rate
infrared
low cost
reliability analysis
analog vlsi
combining multiple
process control
ensemble learning
control architecture
single chip
simplex method
field effect transistors
input output