Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection.
Li-Cheng ShenChien-Wei ChienHsien-Chie ChengChia-Te LinPublished in: Microelectron. Reliab. (2010)
Keyphrases
- high density
- three dimensional
- high speed
- rapid development
- cmos technology
- low cost
- st century
- case study
- technical issues
- metal oxide semiconductor
- information society
- mobile technologies
- web technologies
- current status
- information and communications technologies
- support systems
- information technology
- silicon on insulator
- image sequences
- nsf funded
- internet enabled
- enabling technologies
- analog vlsi
- computational science
- development process
- d objects
- software engineering
- knowledge management
- future development
- data processing
- design process