Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing.
Hsien-Chie ChengTzu-Chin HuangPo-Wen HwangWen-Hwa ChenPublished in: Microelectron. Reliab. (2016)
Keyphrases
- high speed
- multiscale
- image features
- image data
- image segmentation
- input image
- single image
- image analysis
- image classification
- image retrieval
- image content
- segmentation method
- low cost
- high density
- similarity measure
- region of interest
- image processing algorithms
- edge detection
- high resolution
- low power
- image pixels
- image processing
- image matching
- image representation
- real time
- image collections
- pixel values
- digital images
- integrated circuit
- image registration
- numerical solution
- cmos technology