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Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy.
Yi-Shao Lai
Kuo-Ming Chen
Chin-Li Kao
Chiu-Wen Lee
Ying-Ta Chiu
Published in:
Microelectron. Reliab. (2007)
Keyphrases
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electron microscopy
low energy
mechanical properties
x ray
thin film
low cost
image processing
neural network
database systems
signal processing
failure rate