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Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages.
Chin-Li Kao
Tei-Chen Chen
Yi-Shao Lai
Ying-Ta Chiu
Published in:
Microelectron. Reliab. (2014)
Keyphrases
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low cost
real time
line segments
hough transform
data sets
high speed
scale space
fine grained
levels of abstraction
neural network
input output
small scale
integrated circuit
scale invariant
analog vlsi