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Structural design optimization for board-level drop reliability of wafer-level chip-scale packages.

Tsung-Yueh TsaiYi-Shao LaiChang-Lin YehRong-Sheng Chen
Published in: Microelectron. Reliab. (2008)
Keyphrases
  • structural design
  • higher level
  • artificial neural networks
  • computational intelligence
  • scale space
  • fuzzy inference