Chang-Lin Yeh

Publication Activity (10 Years)

Years Active: 2005-2011
Publications (10 Years): 0

Publications

Hsiang-Chen Hsu, Wei-Yao Chang, Chang-Lin Yeh, Yi-Shao Lai
Characteristic of copper wire and transient analysis on wirebonding process. Microelectron. Reliab. 51 (1) (2011)
Chang-Lin Yeh, Yi-Shao Lai
Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops. Microelectron. Reliab. 48 (2) (2008)
Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen
Finite element model verification for packaged printed circuit board by experimental modal analysis. Microelectron. Reliab. 48 (11-12) (2008)
Yi-Shao Lai, Po-Chuan Yang, Chang-Lin Yeh
Effects of different drop test conditions on board-level reliability of chip-scale packages. Microelectron. Reliab. 48 (2) (2008)
Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. Microelectron. Reliab. 48 (5) (2008)
Yi-Shao Lai, Hsiao-Chuan Chang, Chang-Lin Yeh
Evaluation of solder joint strengths under ball impact test. Microelectron. Reliab. 47 (12) (2007)
Chang-Lin Yeh, Yi-Shao Lai, Hsiao-Chuan Chang, Tsan-Hsien Chen
Empirical correlation between package-level ball impact test and board-level drop reliability. Microelectron. Reliab. 47 (7) (2007)
Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. Microelectron. Reliab. 47 (12) (2007)
Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. Microelectron. Reliab. 47 (8) (2007)
Chang-Lin Yeh, Yi-Shao Lai
Support excitation scheme for transient analysis of JEDEC board-level drop test. Microelectron. Reliab. 46 (2-4) (2006)
Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao
Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectron. Reliab. 46 (7) (2006)
Chang-Lin Yeh, Yi-Shao Lai
Transient fracturing of solder joints subjected to displacement-controlled impact loads. Microelectron. Reliab. 46 (5-6) (2006)
Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectron. Reliab. 46 (2-4) (2006)
Chang-Lin Yeh, Yi-Shao Lai
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. Microelectron. Reliab. 45 (2) (2005)