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Finite element model verification for packaged printed circuit board by experimental modal analysis.

Ying-Chih LeeBor-Tsuen WangYi-Shao LaiChang-Lin YehRong-Sheng Chen
Published in: Microelectron. Reliab. (2008)
Keyphrases
  • finite element model
  • printed circuit boards
  • experimental data
  • finite element analysis
  • real time
  • sufficient conditions
  • numerical simulations
  • stress response