Rong-Sheng Chen

Publication Activity (10 Years)

Years Active: 2007-2015
Publications (10 Years): 1

Top Topics

Genetic Algorithm

Simulated Annealing

Reliability Analysis

Top Venues

Microelectron. Reliab.

Qual. Reliab. Eng. Int.

Publications

Hsin-En Cheng, Rong-Sheng Chen, Chao-Yang Mao
Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls. Qual. Reliab. Eng. Int. 31 (4) (2015)
Hsin-En Cheng, Rong-Sheng Chen
Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method. Microelectron. Reliab. 54 (12) (2014)
Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen
Finite element model verification for packaged printed circuit board by experimental modal analysis. Microelectron. Reliab. 48 (11-12) (2008)
Ping-Feng Yang, Hua-Chiang Wen, Sheng-Rui Jian, Yi-Shao Lai, Sean Wu, Rong-Sheng Chen
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering. Microelectron. Reliab. 48 (3) (2008)
Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. Microelectron. Reliab. 48 (5) (2008)
Chao-Yang Mao, Rong-Sheng Chen
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint. Microelectron. Reliab. 48 (1) (2008)
Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. Microelectron. Reliab. 47 (8) (2007)