Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint.
Chao-Yang MaoRong-Sheng ChenPublished in: Microelectron. Reliab. (2008)
Keyphrases
- design parameters
- joint optimization
- statistical analysis
- database systems
- printed circuit boards
- design process
- building blocks
- optimal design
- design decisions
- reliability analysis
- optimization algorithm
- knowledge based systems
- high speed
- optimum design
- data sets
- strain energy
- mechanical properties
- high temperature
- database
- high density
- optimization methods
- design principles
- power system
- multi objective
- image analysis
- expert systems