Chao-Yang Mao

Publication Activity (10 Years)

Years Active: 2008-2015
Publications (10 Years): 0

Top Topics

Dynamic Programming

Optimal Parameters

Reliability Analysis

Top Venues

Qual. Reliab. Eng. Int.

Publications

Hsin-En Cheng, Rong-Sheng Chen, Chao-Yang Mao
Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls. Qual. Reliab. Eng. Int. 31 (4) (2015)
Chao-Yang Mao, Rong-Sheng Chen
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint. Microelectron. Reliab. 48 (1) (2008)