Login / Signup
Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls.
Hsin-En Cheng
Rong-Sheng Chen
Chao-Yang Mao
Published in:
Qual. Reliab. Eng. Int. (2015)
Keyphrases
</>
high speed
high density
reliability analysis
dynamic programming
statistical analysis
image analysis
worst case
low cost
closed form
optimal parameters
data sets
neural network
data analysis
parameter settings