Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method.
Hsin-En ChengRong-Sheng ChenPublished in: Microelectron. Reliab. (2014)
Keyphrases
- optimal design
- genetic algorithm
- detection method
- clustering method
- optimization method
- experimental evaluation
- high accuracy
- computational complexity
- hybrid algorithm
- multi objective
- computational cost
- simulated annealing
- data sets
- classification method
- optimization algorithm
- fuzzy logic
- dynamic programming
- prior knowledge
- pairwise