Tsung-Yueh Tsai

Publication Activity (10 Years)

Years Active: 2007-2010
Publications (10 Years): 0

Publications

Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. Microelectron. Reliab. 50 (4) (2010)
S. T. Jenq, Hsuan-Hu Chang, Yi-Shao Lai, Tsung-Yueh Tsai
High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys. Microelectron. Reliab. 49 (3) (2009)
Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. Microelectron. Reliab. 48 (5) (2008)
Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. Microelectron. Reliab. 47 (12) (2007)
Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. Microelectron. Reliab. 47 (8) (2007)