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Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package.

Theresa SzeDarko PopovicJing ShiYi-Shao LaiJames G. MitchellBruce GueninTsung-Yueh TsaiChin-Li KaoMatthew Giere
Published in: Microelectron. Reliab. (2010)
Keyphrases
  • high speed
  • low cost
  • analog vlsi
  • high density
  • single chip
  • programmable logic
  • circuit design
  • high bandwidth
  • vlsi implementation
  • physical design
  • vlsi design
  • real time
  • communication networks
  • chip design
  • network on chip