S. W. Ricky Lee

Publication Activity (10 Years)

Years Active: 2011-2016
Publications (10 Years): 1

Top Topics

Failure Detection

Semiconductor Manufacturing

Top Venues

Microelectron. Reliab.

Publications

Chaoran Yang, Fuliang Le, S. W. Ricky Lee
Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints. Microelectron. Reliab. 62 (2016)
Chaoran Yang, Fubin Song, S. W. Ricky Lee
Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints. Microelectron. Reliab. 54 (2) (2014)
Cheng-Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai
Reliability of high-power LED packaging and assembly. Microelectron. Reliab. 52 (5) (2012)
Rong Zhang, S. W. Ricky Lee
Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches. Microelectron. Reliab. 52 (5) (2012)
Catherine H. Chen, Shawn X. Zhang, S. W. Ricky Lee, Lebbai Mohamed
Investigation on copper diffusion depth in copper wire bonding. Microelectron. Reliab. 51 (1) (2011)