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Redistribution in wafer level chip size packaging technology for high power device applications: Process and design considerations.
Jiunn Chen
Yi-Shao Lai
Chueh-An Hsieh
Chia Yi Hu
Published in:
Microelectron. Reliab. (2010)
Keyphrases
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design considerations
high power
high density
high speed
low cost
design process
low power
cost effective
random access memory
metadata
high resolution
integrated circuit