Fine pitch copper wire bonding in high volume production.

Bernd K. Appelt Andy Tseng Chun-Hsiung Chen Yi-Shao Lai

Published in: Microelectron. Reliab. (2011)

Keyphrases

high volume
wire bonding
bond pad
stress response
real time
big data
real world
call center
information retrieval
query processing
object oriented
decision makers
thin film
printed circuit boards