Advances in Wafer Level Packaging (WLP).

Tong Yan Tee Xuejun Fan Yi-Shao Lai

Published in: Microelectron. Reliab. (2010)

Keyphrases

recent advances
high speed
object level
neural network
artificial intelligence
integrated circuit
high level
levels of abstraction
high density
data structure
database systems
data sets
decision trees
multimedia
genetic algorithm
machine learning
databases