Tong Yan Tee

Publication Activity (10 Years)

Years Active: 2003-2010
Publications (10 Years): 0

Publications

Ahmer Syed, Tong Yan Tee, Hun Shen Ng, Rex Anderson, Choong Peng Khoo, Boyd Rogers
Advanced analysis on board trace reliability of WLCSP under drop impact. Microelectron. Reliab. 50 (7) (2010)
Tong Yan Tee, Xuejun Fan, Yi-Shao Lai
Advances in Wafer Level Packaging (WLP). Microelectron. Reliab. 50 (4) (2010)
Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong
Dynamic responses and solder joint reliability under board level drop test. Microelectron. Reliab. 47 (2-3) (2007)
Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA. Microelectron. Reliab. 46 (12) (2006)
Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong
Impact life prediction modeling of TFBGA packages under board level drop test. Microelectron. Reliab. 44 (7) (2004)
Tong Yan Tee, Zhaowei Zhong
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis. Microelectron. Reliab. 44 (1) (2004)
Tong Yan Tee, Zhaowei Zhong
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages. Microelectron. Reliab. 44 (12) (2004)
Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. Microelectron. Reliab. 43 (5) (2003)
Tong Yan Tee, Giovanni Frezza, Mayhuan Lim, Hun Shen Ng, Federico Ziglioli, Zhaowei Zhong
Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn. Int. J. Comput. Eng. Sci. 4 (2) (2003)
Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages. Microelectron. Reliab. 43 (8) (2003)
Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. Microelectron. Reliab. 43 (7) (2003)