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Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages.

Tong Yan TeeHun Shen NgDaniel YapZhaowei Zhong
Published in: Microelectron. Reliab. (2003)
Keyphrases
  • software reliability
  • failure rate
  • data sets
  • neural network
  • levels of abstraction
  • modeling method
  • databases
  • data mining
  • data structure
  • mobile robot
  • higher level
  • modeling framework