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Dynamic responses and solder joint reliability under board level drop test.
Jing-en Luan
Tong Yan Tee
Eric Pek
Chwee Teck Lim
Zhaowei Zhong
Published in:
Microelectron. Reliab. (2007)
Keyphrases
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failure rate
high level
dynamic environments
levels of abstraction
dynamically changing
real time
genetic algorithm
information systems
image sequences
multiscale
mobile robot
higher level
statistically significant
test data
reliability assessment
pattern generator