Chwee Teck Lim

Publication Activity (10 Years)

Years Active: 2004-2023
Publications (10 Years): 5

Top Topics

Physical Characteristics

American Sign Language

Top Venues

PLoS Comput. Biol.

Publications

Huanqian Zhang, Jee Chin Teoh, Jianfeng Wu, Longteng Yu, Chwee Teck Lim
Dynamic Zero Current Method to Reduce Measurement Error in Low Value Resistive Sensor Array for Wearable Electronics. Sensors 23 (3) (2023)
Sejal Ghate, Longteng Yu, Kang Du, Chwee Teck Lim, Joo Chuan Yeo
Sensorized fabric glove as game controller for rehabilitation. IEEE SENSORS (2020)
Kirill Lykov, Yasaman Nematbakhsh, Menglin Shang, Chwee Teck Lim, Igor V. Pivkin
Probing eukaryotic cell mechanics via mesoscopic simulations. PLoS Comput. Biol. 13 (9) (2017)
Joo Chuan Yeo, Cassidy Lee, Zhiping Wang, Chwee Teck Lim
Tactile sensorized glove for force and motion sensing. IEEE SENSORS (2016)
Zheren Du, Lianwei Chen, Dacheng Wang, Zuyong Wang, Chwee Teck Lim, Minghui Hong, Yang Li, Xiong Li, Xiangang Luo, Fang Kong, Ming Dao, Yu Cao, Fengping Li
3D micro-concrete hybrid structures fabricated by femtosecond laser two-photon polymerization for biomedical and photonic applications. ICIT (2016)
Han Wei Hou, Ali Asgar S. Bhagat, Wong Cheng Lee, Sha Huang, Jongyoon Han, Chwee Teck Lim
Microfluidic Devices for Blood Fractionation. Micromachines 2 (3) (2011)
Chwee Teck Lim, Jongyoon Han, Jochen R. Guck, Horacio Espinosa
Micro and nanotechnology for biological and biomedical applications. Medical Biol. Eng. Comput. 48 (10) (2010)
Ali Asgar S. Bhagat, Hansen Bow, Han Wei Hou, Swee Jin Tan, Jongyoon Han, Chwee Teck Lim
Microfluidics for cell separation. Medical Biol. Eng. Comput. 48 (10) (2010)
Long Bin Tan, Xiaowu Zhang, Chwee Teck Lim, Vincent B. C. Tan
Mapping the failure envelope of board-level solder joints. Microelectron. Reliab. 49 (4) (2009)
Swee Jin Tan, Levent Yobas, Gabriel Yew Hoe Lee, Choon Nam Ong, Chwee Teck Lim
Microdevice for Isolating Viable Circulating Tumor Cells. BIOTECHNO (2008)
Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong
Dynamic responses and solder joint reliability under board level drop test. Microelectron. Reliab. 47 (2-3) (2007)
Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong
Impact life prediction modeling of TFBGA packages under board level drop test. Microelectron. Reliab. 44 (7) (2004)