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Mapping the failure envelope of board-level solder joints.

Long Bin TanXiaowu ZhangChwee Teck LimVincent B. C. Tan
Published in: Microelectron. Reliab. (2009)
Keyphrases
  • pixel level
  • higher level
  • artificial intelligence
  • levels of abstraction
  • databases
  • neural network
  • data mining
  • decision making
  • case study
  • search algorithm
  • multiresolution
  • wireless sensor networks
  • lower level