Mapping the failure envelope of board-level solder joints.

Long Bin Tan Xiaowu Zhang Chwee Teck Lim Vincent B. C. Tan

Published in: Microelectron. Reliab. (2009)

Keyphrases

pixel level
higher level
artificial intelligence
levels of abstraction
databases
neural network
data mining
decision making
case study
search algorithm
multiresolution
wireless sensor networks
lower level