Xiaowu Zhang

Publication Activity (10 Years)

Years Active: 2004-2024
Publications (10 Years): 25

Top Topics

Fuel Consumption

Face Recognition

Hyperspectral Image Classification

Top Venues

IEEE Trans. Veh. Technol.

IEEE Trans. Control. Syst. Technol.

Publications

Li He, Xiaowu Zhang, Jianyong Duan, Hao Wang, Xin Li, Liang Zhao
PSDSpell: Pre-Training with Self-Distillation Learning for Chinese Spelling Correction. IEICE Trans. Inf. Syst. 107 (4) (2024)
Chaobin Xu, Wei Li, Xiaohui Cui, Zhenyu Wang, Fengling Zheng, Xiaowu Zhang, Bin Chen
Scarcity-GAN: Scarce data augmentation for defect detection via generative adversarial nets. Neurocomputing 566 (2024)
Jianli Bai, Xiaowu Zhang, Xiangfu Song, Hang Shao, Qifan Wang, Shujie Cui, Giovanni Russello
CryptoMask : Privacy-preserving Face Recognition. CoRR (2023)
Yuanbin Xu, Tian Tian, Pingfei Zhu, Xiaowu Zhang, Tongwei Li, Yuqing Chen
Research on optimization algorithm of business system design based on graph theory and its application in digital power marketing business system design. IoTAAI (2023)
Jianli Bai, Xiangfu Song, Xiaowu Zhang, Qifan Wang, Shujie Cui, Ee-Chien Chang, Giovanni Russello
Mostree: Malicious Secure Private Decision Tree Evaluation with Sublinear Communication. ACSAC (2023)
Xiaowu Zhang, Xiaotian Zhang, Cheng Yang, Hang Yan, Xipeng Qiu
Does Correction Remain A Problem For Large Language Models? CoRR (2023)
Yaxin Zhao, Yuebing Xu, Jiadong Ye, Xiaowu Zhang, Zuqiang Long
Urban Water Supply Forecasting Based on CNN-LSTM-AM Spatiotemporal Deep Learning Model. IEEE Access 11 (2023)
Hao Guo, Wenxing Bao, Wei Feng, Shasha Sun, Lei Yang, Kewen Qu, Xuan Ma, Xiaowu Zhang
Multispectral and Hyperspectral Image Fusion Based on Coupled Non-Negative Block Term Tensor Decomposition with Joint Structured Sparsity. IGARSS (2023)
Jianli Bai, Xiaowu Zhang, Xiangfu Song, Hang Shao, Qifan Wang, Shujie Cui, Giovanni Russello
CryptoMask: Privacy-Preserving Face Recognition. ICICS (2023)
Zhanwen Zhou, Hankz Hankui Zhuo, Xiaowu Zhang, Qiyuan Deng
XRoute Environment: A Novel Reinforcement Learning Environment for Routing. CoRR (2023)
Shasha Sun, Wenxing Bao, Kewen Qu, Wei Feng, Xiaowu Zhang, Xuan Ma
Hyperspectral Image Super-Resolution Algorithm Based on Graph Regular Tensor Ring Decomposition. Remote. Sens. 15 (20) (2023)
Jianli Bai, Xiangfu Song, Xiaowu Zhang, Qifan Wang, Shujie Cui, Ee-Chien Chang, Giovanni Russello
Mostree : Malicious Secure Private Decision Tree Evaluation with Sublinear Communication. CoRR (2023)
Hongbo Liang, Wenxing Bao, Xiangfei Shen, Xiaowu Zhang
HSI-Mixer: Hyperspectral Image Classification Using the Spectral-Spatial Mixer Representation From Convolutions. IEEE Geosci. Remote. Sens. Lett. 19 (2022)
Meng Cao, Wenxing Bao, Kewen Qu, Xiaowu Zhang, Xuan Ma
Nonlocal Low-Rank Regularization for Hyperspectral and High-Resolution Remote Sensing Image Fusion. IGARSS (2022)
Xiangfei Shen, Wenxing Bao, Hongbo Liang, Xiaowu Zhang, Xuan Ma
Grouped Collaborative Representation for Hyperspectral Image Classification Using a Two-Phase Strategy. IEEE Geosci. Remote. Sens. Lett. 19 (2022)
Hongbo Liang, Wenxing Bao, Xiangfei Shen, Xiaowu Zhang
Spectral-Spatial Attention Feature Extraction for Hyperspectral Image Classification Based on Generative Adversarial Network. IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens. 14 (2021)
Qun Zhou, Wenxing Bao, Xiaowu Zhang, Xuan Ma
A Joint Spatial-Spectral Representation Based Capsule Network for Hyperspectral Image Classification. WHISPERS (2021)
Xiaowu Zhang, Li Li
Attentional Neural Factorization Machines for Knowledge Tracing. KSEM (2021)
Sishun Liu, Pengju Shuai, Xiaowu Zhang, Shuang Chen, Li Li, Ming Liu
Fine-Tuned Transformer Model for Sentiment Analysis. KSEM (2) (2020)
Weichao Zhuang, Xiaowu Zhang, Guodong Yin, Huei Peng, Liangmo Wang
Mode Shift Schedule and Control Strategy Design of Multimode Hybrid Powertrain. IEEE Trans. Control. Syst. Technol. 28 (3) (2020)
Qingfeng Lin, Shengbo Eben Li, Xuejin Du, Xiaowu Zhang, Huei Peng, Yugong Luo, Keqiang Li
Minimize the Fuel Consumption of Connected Vehicles Between Two Red-Signalized Intersections in Urban Traffic. IEEE Trans. Veh. Technol. 67 (10) (2018)
Weichao Zhuang, Xiaowu Zhang, Ding Zhao, Huei Peng, Lianmou Wang
Optimal design of three-planetary-gear power-split hybrid powertrains. CoRR (2017)
Shaobing Xu, Shengbo Eben Li, Huei Peng, Bo Cheng, Xiaowu Zhang, Ziheng Pan
Fuel-Saving Cruising Strategies for Parallel HEVs. IEEE Trans. Veh. Technol. 65 (6) (2016)
Fa Xing Che, Xiaowu Zhang, Jong-Kai Lin
Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis. Microelectron. Reliab. 61 (2016)
Xiaowu Zhang, Shengbo Eben Li, Huei Peng, Jing Sun
Design of Multimode Power-Split Hybrid Vehicles - A Case Study on the Voltec Powertrain System. IEEE Trans. Veh. Technol. 65 (6) (2016)
Yong Han, Boon Long Lau, Boo Yang Jung, Xiaowu Zhang
Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package. IEEE Des. Test 32 (4) (2015)
Xiaowu Zhang, Huei Peng, Jing Sun
A Near-Optimal Power Management Strategy for Rapid Component Sizing of Multimode Power Split Hybrid Vehicles. IEEE Trans. Control. Syst. Technol. 23 (2) (2015)
Shaobing Xu, Shengbo Eben Li, Xiaowu Zhang, Bo Cheng, Huei Peng
Fuel-Optimal Cruising Strategy for Road Vehicles With Step-Gear Mechanical Transmission. IEEE Trans. Intell. Transp. Syst. 16 (6) (2015)
Xiaowu Zhang, Huei Peng, Jing Sun
A near-optimal power management strategy for rapid component sizing of power split hybrid vehicles with multiple operating modes. ACC (2013)
Xiaowu Zhang, Chiao-Ting Li, Dongsuk Kum, Huei Peng
: Configuration Analysis of Power-Split Hybrid Vehicles With a Single Planetary Gear. IEEE Trans. Veh. Technol. 61 (8) (2012)
A. D. Trigg, Tai Chong Chai, Xiaowu Zhang, Xian Tong Chen, Leong Ching Wai
Modular sensor chip design for package stress evaluation and reliability characterisation. Microelectron. Reliab. 52 (8) (2012)
Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong
A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications. 3DIC (2011)
Y. C. Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu
Electromigration performance of Through Silicon Via (TSV) - A modeling approach. Microelectron. Reliab. 50 (9-11) (2010)
Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Zhang Yanfeng, Juan Boon Tan, Dong Kyun Sohn
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. Microelectron. Reliab. 50 (7) (2010)
Long Bin Tan, Xiaowu Zhang, Chwee Teck Lim, Vincent B. C. Tan
Mapping the failure envelope of board-level solder joints. Microelectron. Reliab. 49 (4) (2009)
Xiaowu Zhang, Kripesh Vaidyanathan, Tai Chong Chai, Teck Chun Tan, D. Pinjala
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). Microelectron. Reliab. 48 (4) (2008)
Xiaowu Zhang, Ee-Hua Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao
Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. Microelectron. Reliab. 45 (7-8) (2005)
Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath
Thermo-mechanical finite element analysis in a multichip build up substrate based package design. Microelectron. Reliab. 44 (4) (2004)