Teck Chun Tan

Publication Activity (10 Years)

Years Active: 2008-2008
Publications (10 Years): 0

Publications

Xiaowu Zhang, Kripesh Vaidyanathan, Tai Chong Chai, Teck Chun Tan, D. Pinjala
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). Microelectron. Reliab. 48 (4) (2008)