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Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP).

Xiaowu ZhangKripesh VaidyanathanTai Chong ChaiTeck Chun TanD. Pinjala
Published in: Microelectron. Reliab. (2008)
Keyphrases
  • reliability analysis
  • artificial intelligence
  • case study
  • neural network
  • decision trees
  • semiconductor manufacturing