D. Pinjala

Publication Activity (10 Years)

Years Active: 2004-2008
Publications (10 Years): 0

Publications

Xiaowu Zhang, Kripesh Vaidyanathan, Tai Chong Chai, Teck Chun Tan, D. Pinjala
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). Microelectron. Reliab. 48 (4) (2008)
Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath
Thermo-mechanical finite element analysis in a multichip build up substrate based package design. Microelectron. Reliab. 44 (4) (2004)