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Thermo-mechanical finite element analysis in a multichip build up substrate based package design.
Xiaowu Zhang
Ee-Hua Wong
Charles Lee
Tai Chong Chai
Yiyi Ma
Poi-Siong Teo
D. Pinjala
Srinivasamurthy Sampath
Published in:
Microelectron. Reliab. (2004)
Keyphrases
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finite element analysis
computer aided design
mechanical design
finite element
finite element model
using artificial neural networks
machine learning
design process
computer vision
image processing
case study
user interface
single image
contact force