Tai Chong Chai

Publication Activity (10 Years)

Years Active: 2002-2012
Publications (10 Years): 0

Top Topics

Sensor Networks

Top Venues

Microelectron. Reliab.

Publications

A. D. Trigg, Tai Chong Chai, Xiaowu Zhang, Xian Tong Chen, Leong Ching Wai
Modular sensor chip design for package stress evaluation and reliability characterisation. Microelectron. Reliab. 52 (8) (2012)
Y. C. Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu
Electromigration performance of Through Silicon Via (TSV) - A modeling approach. Microelectron. Reliab. 50 (9-11) (2010)
Xiaowu Zhang, Kripesh Vaidyanathan, Tai Chong Chai, Teck Chun Tan, D. Pinjala
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). Microelectron. Reliab. 48 (4) (2008)
Cher Ming Tan, Stanny Yanuar, Tai Chong Chai
Finite element modeling of capacitive coupling voltage contrast. Microelectron. Reliab. 47 (9-11) (2007)
Cher Ming Tan, Zhenghao Gan, Tai Chong Chai
Feasibility study of the application of voltage contrast to printed circuit board. Microelectron. Reliab. 46 (5-6) (2006)
Cher Ming Tan, Kim Peng Lim, Tai Chong Chai, Guat Cheng Lim
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist. Microelectron. Reliab. 45 (9-11) (2005)
Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath
Thermo-mechanical finite element analysis in a multichip build up substrate based package design. Microelectron. Reliab. 44 (4) (2004)
Mohandass Sivakumar, Kripesh Vaidyanathan, Chong Ser Choong, Tai Chong Chai, Loon Aik Lim
Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly. Microelectron. Reliab. 42 (9-11) (2002)