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Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly.

Mohandass SivakumarKripesh VaidyanathanChong Ser ChoongTai Chong ChaiLoon Aik Lim
Published in: Microelectron. Reliab. (2002)
Keyphrases
  • integrated circuit
  • printed circuit boards
  • stress response
  • wire bonding
  • electron beam
  • bond pad
  • assembly process
  • sufficient conditions
  • finite element model