Ee-Hua Wong

Publication Activity (10 Years)

Years Active: 2003-2017
Publications (10 Years): 4

Top Topics

Injection Lasers

Analogical Reasoning

Diffusion Process

Diffusion Model

Top Venues

Microelectron. Reliab.

Publications

Ee-Hua Wong, Johan Liu
Interface and interconnection stresses in electronic assemblies - A critical review of analytical solutions. Microelectron. Reliab. 79 (2017)
Ee-Hua Wong, S. B. Park
Moisture diffusion modeling - A critical review. Microelectron. Reliab. 65 (2016)
Ee-Hua Wong, W. D. van Driel, A. Dasgupta, Michael G. Pecht
Creep fatigue models of solder joints: A critical review. Microelectron. Reliab. 59 (2016)
Ee-Hua Wong, J. Chrisp, C. S. Selvanayagam, S. K. W. Seah
Constitutive modeling of solder alloys for drop-impact applications. Microelectron. Reliab. 67 (2016)
Ee-Hua Wong
The fundamentals of thermal-mass diffusion analogy. Microelectron. Reliab. 55 (3-4) (2015)
Ee-Hua Wong, Jarrod Cook, M. Dreno, Dao-Long Chen, Yi-Shao Lai
Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption. Microelectron. Reliab. 55 (11) (2015)
Ee-Hua Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai
Advances in the drop-impact reliability of solder joints for mobile applications. Microelectron. Reliab. 49 (2) (2009)
Ee-Hua Wong, Yiu-Wing Mai
The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation. Microelectron. Reliab. 49 (8) (2009)
Ee-Hua Wong, S. K. W. Seah, V. P. W. Shim
A review of board level solder joints for mobile applications. Microelectron. Reliab. 48 (11-12) (2008)
Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh
Correlation studies for component level ball impact shear test and board level drop test. Microelectron. Reliab. 48 (7) (2008)
Ee-Hua Wong, Yiu-Wing Mai
New insights into board level drop impact. Microelectron. Reliab. 46 (5-6) (2006)
Xiaowu Zhang, Ee-Hua Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao
Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. Microelectron. Reliab. 45 (7-8) (2005)
Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath
Thermo-mechanical finite element analysis in a multichip build up substrate based package design. Microelectron. Reliab. 44 (4) (2004)
Ee-Hua Wong, Ranjan Rajoo
Moisture absorption and diffusion characterisation of packaging materials--advanced treatment. Microelectron. Reliab. 43 (12) (2003)