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Ee-Hua Wong
ORCID
Publication Activity (10 Years)
Years Active: 2003-2017
Publications (10 Years): 4
Top Topics
Injection Lasers
Analogical Reasoning
Diffusion Process
Diffusion Model
Top Venues
Microelectron. Reliab.
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Publications
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Ee-Hua Wong
,
Johan Liu
Interface and interconnection stresses in electronic assemblies - A critical review of analytical solutions.
Microelectron. Reliab.
79 (2017)
Ee-Hua Wong
,
S. B. Park
Moisture diffusion modeling - A critical review.
Microelectron. Reliab.
65 (2016)
Ee-Hua Wong
,
W. D. van Driel
,
A. Dasgupta
,
Michael G. Pecht
Creep fatigue models of solder joints: A critical review.
Microelectron. Reliab.
59 (2016)
Ee-Hua Wong
,
J. Chrisp
,
C. S. Selvanayagam
,
S. K. W. Seah
Constitutive modeling of solder alloys for drop-impact applications.
Microelectron. Reliab.
67 (2016)
Ee-Hua Wong
The fundamentals of thermal-mass diffusion analogy.
Microelectron. Reliab.
55 (3-4) (2015)
Ee-Hua Wong
,
Jarrod Cook
,
M. Dreno
,
Dao-Long Chen
,
Yi-Shao Lai
Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption.
Microelectron. Reliab.
55 (11) (2015)
Ee-Hua Wong
,
S. K. W. Seah
,
W. D. van Driel
,
J. F. J. M. Caers
,
N. Owens
,
Y.-S. Lai
Advances in the drop-impact reliability of solder joints for mobile applications.
Microelectron. Reliab.
49 (2) (2009)
Ee-Hua Wong
,
Yiu-Wing Mai
The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation.
Microelectron. Reliab.
49 (8) (2009)
Ee-Hua Wong
,
S. K. W. Seah
,
V. P. W. Shim
A review of board level solder joints for mobile applications.
Microelectron. Reliab.
48 (11-12) (2008)
Ee-Hua Wong
,
Ranjan Rajoo
,
S. K. W. Seah
,
C. S. Selvanayagam
,
W. D. van Driel
,
J. F. J. M. Caers
,
X. J. Zhao
,
N. Owens
,
L. C. Tan
,
M. Leoni
,
P. L. Eu
,
Y.-S. Lai
,
C.-L. Yeh
Correlation studies for component level ball impact shear test and board level drop test.
Microelectron. Reliab.
48 (7) (2008)
Ee-Hua Wong
,
Yiu-Wing Mai
New insights into board level drop impact.
Microelectron. Reliab.
46 (5-6) (2006)
Xiaowu Zhang
,
Ee-Hua Wong
,
Ranjan Rajoo
,
Mahadevan K. Iyer
,
J. F. J. M. Caers
,
X. J. Zhao
Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives.
Microelectron. Reliab.
45 (7-8) (2005)
Xiaowu Zhang
,
Ee-Hua Wong
,
Charles Lee
,
Tai Chong Chai
,
Yiyi Ma
,
Poi-Siong Teo
,
D. Pinjala
,
Srinivasamurthy Sampath
Thermo-mechanical finite element analysis in a multichip build up substrate based package design.
Microelectron. Reliab.
44 (4) (2004)
Ee-Hua Wong
,
Ranjan Rajoo
Moisture absorption and diffusion characterisation of packaging materials--advanced treatment.
Microelectron. Reliab.
43 (12) (2003)