C. S. Selvanayagam

Publication Activity (10 Years)

Years Active: 2008-2016
Publications (10 Years): 1

Top Topics

Mechanical Properties

Top Venues

Microelectron. Reliab.

Publications

Ee-Hua Wong, J. Chrisp, C. S. Selvanayagam, S. K. W. Seah
Constitutive modeling of solder alloys for drop-impact applications. Microelectron. Reliab. 67 (2016)
Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong
A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications. 3DIC (2011)
Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh
Correlation studies for component level ball impact shear test and board level drop test. Microelectron. Reliab. 48 (7) (2008)