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A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications.
Xiaowu Zhang
Ranjan Rajoo
F. X. Che
C. S. Selvanayagam
W. K. Choi
Shan Gao
Guo-Qiang Lo
Dim-Lee Kwong
Published in:
3DIC (2011)
Keyphrases
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stress response
printed circuit boards
bond pad
high density
wire bonding
database
particle swarm optimization
failure rate
high levels
integrated circuit
image analysis
bayesian networks
similarity measure
decision trees
machine learning
data mining
neural network
data sets