Ranjan Rajoo

Publication Activity (10 Years)

Years Active: 2003-2011
Publications (10 Years): 0

Publications

Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong
A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications. 3DIC (2011)
Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh
Correlation studies for component level ball impact shear test and board level drop test. Microelectron. Reliab. 48 (7) (2008)
Xiaowu Zhang, Ee-Hua Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao
Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. Microelectron. Reliab. 45 (7-8) (2005)
Ee-Hua Wong, Ranjan Rajoo
Moisture absorption and diffusion characterisation of packaging materials--advanced treatment. Microelectron. Reliab. 43 (12) (2003)