F. X. Che

Publication Activity (10 Years)

Years Active: 2006-2015
Publications (10 Years): 0

Top Topics

Factors Affecting

Finite Element Methods

Database Systems

Experimental Design

Top Venues

Microelectron. Reliab.

Publications

F. X. Che, John H. L. Pang
Study on reliability of PQFP assembly with lead free solder joints under random vibration test. Microelectron. Reliab. 55 (12) (2015)
Hongbin Shi, F. X. Che, Cuihua Tian, Rui Zhang, Jong Tae Park, Toshitsugu Ueda
Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods. Microelectron. Reliab. 52 (9-10) (2012)
Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong
A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications. 3DIC (2011)
F. X. Che, W. N. Putra, A. Heryanto, A. Trigg, S. Gao, Chee Lip Gan
Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV). 3DIC (2011)
F. X. Che, John H. L. Pang
Vibration reliability test and finite element analysis for flip chip solder joints. Microelectron. Reliab. 49 (7) (2009)
Yuqi Wang, K. H. Low, John H. L. Pang, Kay Hiang Hoon, F. X. Che, Y. S. Yong
Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards. Microelectron. Reliab. 46 (2-4) (2006)
Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low
Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectron. Reliab. 46 (7) (2006)