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Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards.

Yuqi WangK. H. LowJohn H. L. PangKay Hiang HoonF. X. CheY. S. Yong
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • multi layered
  • impact analysis
  • printed circuit boards
  • dependency analysis
  • source code
  • integrated circuit
  • life cycle
  • machine learning
  • complex systems
  • mathematical model
  • manufacturing process