John H. L. Pang

Publication Activity (10 Years)

Years Active: 2004-2015
Publications (10 Years): 1

Top Topics

Factors Affecting

Database Systems

Top Venues

Microelectron. Reliab.

Publications

F. X. Che, John H. L. Pang
Study on reliability of PQFP assembly with lead free solder joints under random vibration test. Microelectron. Reliab. 55 (12) (2015)
F. X. Che, John H. L. Pang
Vibration reliability test and finite element analysis for flip chip solder joints. Microelectron. Reliab. 49 (7) (2009)
C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. Microelectron. Reliab. 48 (4) (2008)
Yaofeng Sun, John H. L. Pang
Digital image correlation for solder joint fatigue reliability in microelectronics packages. Microelectron. Reliab. 48 (2) (2008)
Yuqi Wang, K. H. Low, John H. L. Pang, Kay Hiang Hoon, F. X. Che, Y. S. Yong
Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards. Microelectron. Reliab. 46 (2-4) (2006)
Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low
Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectron. Reliab. 46 (7) (2006)
X. Q. Shi, John H. L. Pang, X. R. Zhang
Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. Microelectron. Reliab. 44 (5) (2004)