X. Q. Shi

Publication Activity (10 Years)

Years Active: 2003-2004
Publications (10 Years): 0

Publications

X. Q. Shi, John H. L. Pang, X. R. Zhang
Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. Microelectron. Reliab. 44 (5) (2004)
X. Q. Shi, Z. P. Wang, J. P. Pickering
A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages. Microelectron. Reliab. 43 (7) (2003)