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Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system.

X. Q. ShiJohn H. L. PangX. R. Zhang
Published in: Microelectron. Reliab. (2004)
Keyphrases
  • failure rate
  • long term
  • short term
  • highly reliable
  • printed circuit boards
  • neural network
  • genetic algorithm
  • information systems
  • image processing
  • decision trees
  • multiscale
  • pairwise
  • failure prediction
  • phase shifting