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The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging.
C. K. Wong
John H. L. Pang
J. W. Tew
B. K. Lok
H. J. Lu
F. L. Ng
Y. F. Sun
Published in:
Microelectron. Reliab. (2008)
Keyphrases
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