J. W. Tew

Publication Activity (10 Years)

Years Active: 2008-2008
Publications (10 Years): 0

Publications

C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. Microelectron. Reliab. 48 (4) (2008)