F. L. Ng

Publication Activity (10 Years)

Years Active: 2003-2008
Publications (10 Years): 0

Publications

C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun
The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging. Microelectron. Reliab. 48 (4) (2008)
X. Li, Z. P. Fang, F. L. Ng, L. P. Zhao, L. Zhao
Inspection and Image Analysis of Nickel Sulphide Inclusions in Toughened Glass Panels. ICARCV (2006)
Jun Wei, F. L. Ng, M. L. Nai, H. Xie, Peck Cheng Lim, C. K. Wong
Wafer Bonding Process Based On The Taguchi Analysis. Int. J. Comput. Eng. Sci. 4 (2) (2003)