Jun Wei

Publication Activity (10 Years)

Years Active: 2003-2003
Publications (10 Years): 0

Publications

Yufeng Jin, Jun Wei, Peck Cheng Lim, Zhenfeng Wang
Hermetic Packaging Of Mems With Thick Electrodes By Silicon-Glass Anodic Bonding. Int. J. Comput. Eng. Sci. 4 (2) (2003)
W. B. Yu, Jun Wei, Cher Ming Tan, S. S. Deng, M. L. Nai
Influence Of Applied Load On Wafer Bonding In Vacuum. Int. J. Comput. Eng. Sci. 4 (2) (2003)
S. S. Deng, Jun Wei, Cher Ming Tan, M. L. Nai, W. B. Yu, H. Xie
Low Temperature Silicon Wafer Bonding By Sol-Gel Processing. Int. J. Comput. Eng. Sci. 4 (3) (2003)
Zhenfeng Wang, G. J. Qi, Jun Wei, Peck Cheng Lim, Yufeng Jin, C. K. Wong
A Novel Wafer-Level Packaging Solution For Mems. Int. J. Comput. Eng. Sci. 4 (2) (2003)
Jun Wei, F. L. Ng, M. L. Nai, H. Xie, Peck Cheng Lim, C. K. Wong
Wafer Bonding Process Based On The Taguchi Analysis. Int. J. Comput. Eng. Sci. 4 (2) (2003)