Low Temperature Silicon Wafer Bonding By Sol-Gel Processing.

S. S. Deng Jun Wei Cher Ming Tan M. L. Nai W. B. Yu H. Xie

Published in: Int. J. Comput. Eng. Sci. (2003)

Keyphrases

data processing
real time
high speed
integrated circuit
information retrieval
information processing
processing capabilities
data sets
expert systems
low cost
x ray
massively parallel