Cher Ming Tan

Publication Activity (10 Years)

Years Active: 1999-2023
Publications (10 Years): 10

Top Topics

Special Section

Ubiquitous Systems

Top Venues

Microelectron. Reliab.

IEEE Trans. Ind. Electron.

Publications

Peerapat Phetpadriew, Bharatha Kumar Thangarasu, Nagarajan Mahalingam, Zhenghao Lu, Cher Ming Tan, Kiat Seng Yeo
Concurrent Multiband CMOS Low Noise Amplifier Design for Internet of Things Applications. ASICON (2023)
Vimal Kant Pandey, Cher Ming Tan
Effect of resistor tolerance on the performance of resistor network - An application of the statistical design of experiment. Int. J. Circuit Theory Appl. 50 (1) (2022)
Vivek Sangwan, Cher Ming Tan, Dipesh Kapoor, Hsien-Chin Chiu
Electromagnetic Induced Failure in GaN-HEMT High-Frequency Power Amplifier. IEEE Trans. Ind. Electron. 67 (7) (2020)
Preetpal Singh, Cher Ming Tan
Uncover the Degradation Science of Silicone Under the Combined Temperature and Humidity Conditions. IEEE Access 6 (2018)
Nirdosh, Cher Ming Tan, Malay Ranjan Tripathy
A miniaturized T-shaped MIMO antenna for X-band and Ku-band applications with enhanced radiation efficiency. WOCC (2018)
Preetpal Singh, Cher Ming Tan
A review on the humidity reliability of high power white light LEDs. Microelectron. Reliab. 61 (2016)
Asen Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou
Editorial. Microelectron. Reliab. 61 (2016)
Udit Narula, Cher Ming Tan, Chao-Sung Lai
Copper induced synthesis of graphene using amorphous carbon. Microelectron. Reliab. 61 (2016)
Marvin Chan, Cher Ming Tan, Kheng Chooi Lee, Chuan Seng Tan
Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation. Microelectron. Reliab. 61 (2016)
Preetpal Singh, Cher Ming Tan, Liann-Be Chang
Early degradation of high power packaged LEDs under humid conditions and its recovery - Myth of reliability rejuvenation. Microelectron. Reliab. 61 (2016)
Cher Ming Tan, Wen Zhi Yu
Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter. Microelectron. Reliab. 54 (5) (2014)
Song Lan, Cher Ming Tan, Kevin Wu
Methodology of reliability enhancement for high power LED driver. Microelectron. Reliab. 54 (6-7) (2014)
Xiangchen Chen, Cher Ming Tan
Modeling and analysis of gate-all-around silicon nanowire FET. Microelectron. Reliab. 54 (6-7) (2014)
Asen Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou
Special section reliability and variability of devices for circuits and systems. Microelectron. Reliab. 54 (6-7) (2014)
J. Zhang, L. Zhang, Y. Dong, H. Y. Li, Cher Ming Tan, G. Xia, Chuan Seng Tan
The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material. 3DIC (2013)
Minh Duc Le, Cher Ming Tan
Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspection scheduling. Reliab. Eng. Syst. Saf. 113 (2013)
Song Lan, Cher Ming Tan, Kevin Wu
Reliability study of LED driver - A case study of black box testing. Microelectron. Reliab. 52 (9-10) (2012)
Asen Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou
ICMAT 2011 - Reliability and variability of semiconductor devices and ICs. Microelectron. Reliab. 52 (8) (2012)
Cher Ming Tan, Wei Li, Zhenghao Gan
Applications of finite element methods for reliability study of ULSI interconnections. Microelectron. Reliab. 52 (8) (2012)
Sihan Chen, Cher Ming Tan, Guan Hong Tan, Feifei He
Degradation behavior of high power light emitting diode under high frequency switching. Microelectron. Reliab. 52 (9-10) (2012)
Feifei He, Cher Ming Tan
Electromigration reliability of interconnections in RF low noise amplifier circuit. Microelectron. Reliab. 52 (2) (2012)
Feifei He, Cher Ming Tan
Effect of IC layout on the reliability of CMOS amplifiers. Microelectron. Reliab. 52 (8) (2012)
Sihan Joseph Chen, Cher Ming Tan, Boon Khai Eric Chen, Zhi Yong Shaun Chua
Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test. Microelectron. Reliab. 52 (8) (2012)
Feifei He, Cher Ming Tan
Circuit level interconnect reliability study using 3D circuit model. Microelectron. Reliab. 50 (3) (2010)
Feifei He, Cher Ming Tan
Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model. Microelectron. Reliab. 50 (9-11) (2010)
Y. C. Tan, Cher Ming Tan, T. C. Ng
Addressing the challenges in solder resistance measurement for electromigration test. Microelectron. Reliab. 50 (9-11) (2010)
Y. C. Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu
Electromigration performance of Through Silicon Via (TSV) - A modeling approach. Microelectron. Reliab. 50 (9-11) (2010)
C. M. Fu, Cher Ming Tan, S. H. Wu, H. B. Yao
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/Low-k interconnects. Microelectron. Reliab. 50 (9-11) (2010)
Cher Ming Tan, Boon Khai Eric Chen, Kok Peng Toh
Humidity study of a-Si PV cell. Microelectron. Reliab. 50 (9-11) (2010)
Cher Ming Tan, Nagarajan Raghavan
Reply to comments on "A framework to practical predictive maintenance modeling for multi-state systems". Reliab. Eng. Syst. Saf. 94 (3) (2009)
Jie Liao, Cher Ming Tan, Geert Spierings
Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI). Microelectron. Reliab. 49 (9-11) (2009)
Cher Ming Tan, Boon Khai Eric Chen, Gan Xu, Yuanjie Liu
Analysis of humidity effects on the degradation of high-power white LEDs. Microelectron. Reliab. 49 (9-11) (2009)
Arijit Roy, Yuejin Hou, Cher Ming Tan
Electromigration in width transition copper interconnect. Microelectron. Reliab. 49 (9-11) (2009)
Cher Ming Tan, Nagarajan Raghavan
A framework to practical predictive maintenance modeling for multi-state systems. Reliab. Eng. Syst. Saf. 93 (8) (2008)
Guangyu Huang, Cher Ming Tan
Rectifier. J. Electron. Test. 24 (5) (2008)
Cher Ming Tan, Stanny Yanuar, Tai Chong Chai
Finite element modeling of capacitive coupling voltage contrast. Microelectron. Reliab. 47 (9-11) (2007)
Cher Ming Tan, Nagarajan Raghavan
An approach to statistical analysis of gate oxide breakdown mechanisms. Microelectron. Reliab. 47 (9-11) (2007)
Arijit Roy, Cher Ming Tan, Sean J. O'Shea, Kedar Hippalgaonkar, Wulf Hofbauer
Room temperature observation of point defect on gold surface using thermovoltage mapping. Microelectron. Reliab. 47 (9-11) (2007)
Wei Li, Cher Ming Tan
Enhanced finite element modelling of Cu electromigration using ANSYS and matlab. Microelectron. Reliab. 47 (9-11) (2007)
Arijit Roy, Cher Ming Tan
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect. Microelectron. Reliab. 46 (9-11) (2006)
Guangyu Huang, Cher Ming Tan
Device level electrical-thermal-stress coupled-field modeling. Microelectron. Reliab. 46 (9-11) (2006)
Cher Ming Tan, Zhenghao Gan, Tai Chong Chai
Feasibility study of the application of voltage contrast to printed circuit board. Microelectron. Reliab. 46 (5-6) (2006)
Cher Ming Tan, Wei Li, Kok Tong Tan, Frankie Low
Development of highly accelerated electromigration test. Microelectron. Reliab. 46 (9-11) (2006)
Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. Microelectron. Reliab. 45 (9-11) (2005)
Cher Ming Tan, Arijit Roy, Kok Tong Tan, Derek Sim Kwang Ye, Frankie Low
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects. Microelectron. Reliab. 45 (9-11) (2005)
Cher Ming Tan, Zhenghao Gan, Wai Fung Ho, Sam Chen, Robert Liu
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications. Microelectron. Reliab. 45 (1) (2005)
Cher Ming Tan, Joe Chiu, Robert Liu, Guan Zhang
Reliability screening through electrical testing for press-fit alternator power diode in automotive application. Microelectron. Reliab. 45 (9-11) (2005)
Cher Ming Tan, Kim Peng Lim, Tai Chong Chai, Guat Cheng Lim
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist. Microelectron. Reliab. 45 (9-11) (2005)
Guan Zhang, Cher Ming Tan, Kok Tong Tan, Derek Sim Kwang Ye, W. Y. Zhang
Reliability Improvement in Al Metallization: A Combination of Statistical Prediction and Failure Analytical Methodology. Microelectron. Reliab. 44 (9-11) (2004)
W. B. Yu, Jun Wei, Cher Ming Tan, S. S. Deng, M. L. Nai
Influence Of Applied Load On Wafer Bonding In Vacuum. Int. J. Comput. Eng. Sci. 4 (2) (2003)
S. S. Deng, Jun Wei, Cher Ming Tan, M. L. Nai, W. B. Yu, H. Xie
Low Temperature Silicon Wafer Bonding By Sol-Gel Processing. Int. J. Comput. Eng. Sci. 4 (3) (2003)
Cher Ming Tan, Kelvin Ngan Chong Yeo
A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT). J. Electron. Test. 17 (1) (2001)
Cher Ming Tan, King-Jet Tseng
Using power diode models for circuit simulations-a comprehensive review. IEEE Trans. Ind. Electron. 46 (3) (1999)