Kheng Chooi Lee

Publication Activity (10 Years)

Years Active: 2004-2016
Publications (10 Years): 1

Top Topics

Evaluation Methods

Top Venues

Microelectron. Reliab.

Publications

Marvin Chan, Cher Ming Tan, Kheng Chooi Lee, Chuan Seng Tan
Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation. Microelectron. Reliab. 61 (2016)
Kheng Chooi Lee, A. Vythilingam, Peter Alpern
A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages. Microelectron. Reliab. 45 (9-11) (2005)
Peter Alpern, Kheng Chooi Lee, Rainer Tilgner
Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages. Microelectron. Reliab. 44 (9-11) (2004)