Chuan Seng Tan

ORCID

Publication Activity (10 Years)

Years Active: 2004-2021
Publications (10 Years): 10

Top Venues

3DIC

Microelectron. Reliab.

BCICTS

ASP-DAC

Massachusetts Institute of Technology, Cambridge, MA, USA (PHD)

Education History

Massachusetts Institute of Technology, Cambridge, MA, USA

PHD

Publications

Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan
Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. 3DIC (2021)
Pilsoon Choi, Bugra Kanargi, Kenneth E. Lee, Chirn Chye Boon, Evelyn Wang, Chuan Seng Tan, Dimitri A. Antoniadis, Eugene A. Fitzgerald
Monolithically Integrated GaN+CMOS Logic Circuits Design and Electro-Thermal Analysis for High-Voltage Applications. BCICTS (2020)
Alit Apriyana Anak Agung, Peng Zhao, Chuan Seng Tan
TiN Guard Ring Around TSV for Cross-Talk Suppression of Parallel Networking of Data Center. 3DIC (2019)
Simon Chun Kiat Goh, Kailiang Chuan, Chengkuo Lee, Chuan Seng Tan
Mid Infrared Volatile Compounds Detection Using Thermally Reflowed Flip-Stack Die Linear Variable Filter. IEEE SENSORS (2019)
Jing Tao, Hongyu Li, Peng Zhao, Yu Dian Lim, Anak Agung Alit Apriyana, Chuan Seng Tan
Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration. 3DIC (2019)
Simon Chun Kiat Goh, Li Lynn Shiau, Nan Chen, Kailiang Chuan, Beng Kang Tay, Chuan Seng Tan
Two-Step Fabrication of Mid-Infrared Linear Variable Optical Filter Using SU-8 as Mask. NEMS (2018)
Myat Thu Linn Aung, Takefumi Yoshikawa, Chuan Seng Tan, Tony Tae-Hyoung Kim
Yield Enhancement of Face-to-Face Cu-Cu Bonding With Dual-Mode Transceivers in 3DICs. IEEE Trans. Very Large Scale Integr. Syst. 25 (3) (2017)
Ye Lin, Chuan Seng Tan
Through-substrate via (TSV) with embedded capacitor as an on-chip energy storage element. 3DIC (2016)
Marvin Chan, Cher Ming Tan, Kheng Chooi Lee, Chuan Seng Tan
Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation. Microelectron. Reliab. 61 (2016)
Yuan Yuan Dai, Mei Zhen Ng, P. Anantha, Chee Lip Gan, Chuan Seng Tan
Copper micro and nano particles mixture for 3D interconnections application. 3DIC (2015)
Wan Chia Ang, Piotr Kropelmcki, Andrew Benson Randies, Alex Yuandong Gu, Kam Chew Leong, Chuan Seng Tan
Simulation and design of AIN piezoelectric resonator for infrared sensing application utilizing lamb wave mode. ISSNIP (2014)
Wee Loon Ng, Kheng Chok Tee, Junfeng Liu, Yong Chiang Ee, Oliver Aubel, Chuan Seng Tan, Kin Leong Pey
Robust Electromigration reliability through engineering optimization. Microelectron. Reliab. 54 (9-10) (2014)
J. Zhang, L. Zhang, Y. Dong, H. Y. Li, Cher Ming Tan, G. Xia, Chuan Seng Tan
The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material. 3DIC (2013)
Kaushik Ghosh, C. C. Yap, Beng Kang Tay, Chuan Seng Tan
Integration of CNT in TSV (≤5 μm) for 3D IC application and its process challenges. 3DIC (2013)
Yang Shang, Chun Zhang, Hao Yu, Chuan Seng Tan, Xin Zhao, Sung Kyu Lim
Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model. ASP-DAC (2013)
Sai Manoj Pudukotai Dinakarrao, Hao Yu, Yang Shang, Chuan Seng Tan, Sung Kyu Lim
Reliable 3-D Clock-Tree Synthesis Considering Nonlinear Capacitive TSV Model With Electrical-Thermal-Mechanical Coupling. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32 (11) (2013)
Chuan Seng Tan, Dau Fatt Lim, Xiao Fang Ang, J. Wei, K. C. Leong
Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. Microelectron. Reliab. 52 (2) (2012)
Kuan-Neng Chen, Chuan Seng Tan
Integration schemes and enabling technologies for three-dimensional integrated circuits. IET Comput. Digit. Tech. 5 (3) (2011)
Dau Fatt Lim, K. C. Leong, Chuan Seng Tan
Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone. 3DIC (2011)
Revanth Nadipalli, Ji Fan, Holden King Ho Li, Keng Hoong Wee, Hao Yu, Chuan Seng Tan
3D integration of MEMS and CMOS via Cu-Cu bonding with simultaneous formation of electrical, mechanical and hermetic bonds. 3DIC (2011)
Lan Peng, Hongyu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan
Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement. 3DIC (2010)
Shiv Govind Singh, Chuan Seng Tan
Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack. 3DIC (2009)
Dau Fatt Lim, Shiv Govind Singh, Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan
Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. 3DIC (2009)
Shamik Das, Andy Fan, Kuan-Neng Chen, Chuan Seng Tan, Nisha Checka, Rafael Reif
Technology, performance, and computer-aided design of three-dimensional integrated circuits. ISPD (2004)

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Publication Activity (10 Years)

Top Topics

Top Venues

Chuan Seng Tan